Partnership with Altair

We are very happy, and proud to announce the collaboration agreement we have arrived with Altair, an American global technology company that provides software and cloud solutions in the areas of product development, high-performance computing (HPC) and data intelligence. Altair is formed by more than 2,000 scientists, engineers and creative thinkers in 25 countries serving 5,000+ customers.

What is more important for us is that Altair is a global leader in mechanical design software. Some of their key points are Finite Element Analysis (FEA), Topological Optimization, and also software for the design and optimization of structural composite parts.


This agreement allows Bottpower to use all the different software packages from Altair, as well as to receive training to learn to use them properly.
This is really great news for us because we are sure that using these tools will allow us to take a step forward in our design and engineering capabilities.

In the next photo, I am in the Altair Spain headquarters with Javier Saavedra from Altair Spain.

Javier Saavedra and David Sánchez at Altair Spain headquarters in Madrid

Here we have the BOTT 1000 Morlaco in our design office. As you can see, we already put the Altair logo on the wall, together with the rest of the companies that are collaborating with us.

Altair's logo in Bottpower's office

 

Altair's logo in Bottpower's office

Altair's logo in Bottpower's office

 

We already started “playing” with Inspire, the industry’s most powerful and easy-to-use Generative Design/Topology Optimization and rapid simulation solution for design engineers.

Working with Inspire

Finally, here you have a video showing an example of the design possibilities of Altair’s software.


We are really excited! During the next months, we will show you different examples of how we use these software design tools in our new projects.
Let’s see what we are able to do using Altair’s software! 🙂

Photos by Mario Rodrigo.

Leave a Comment

Your email address will not be published. Required fields are marked *